AUTOMATIC WAFER SORTING SYSTEM
AE1-X00

* Unloading Accomplished Through Keypad Commands, and may be Programmed for Specific
    or Customized Sequences
* Sorting & Combining by Two Methods: Manual, & Pre-Programmed Sort Routines
* Menu Driven Programming for Operator and Maintenance
* Wafers Mapped & Monitored During Robotic Transfer
* Small Foot Print & Exhaust Ported

Description:
Wafer sorting and stuffing, with one elevator for two cassettes. Includes camera and monitor.

Options:
OCR System for Optical Character Reading
Stainless Steel Covers
RS232 Communications Port
SECS II / Gem Interface
Tilt Inspection

Specifications:
Pressure: 55 to 65 PSI C.D.A. or N2
Power: 110-220 V.A.C. 50-60 hertz
Vacuum:22" Hg
Exhaust: 1.25" Port Dia.
Wafer Size 4" – 8"
Dimensions: (4-6") 12.5" W x 24" D x 24" H