Flat Aligner Tools (TBM-x00 & AFF-x00)

Specifications

  • Wafer Size:4″, 5″, 6″ & 8″
  • Weight: 5 Lbs. Approx.
  • Dimensions: 4.5″ (W) x 7.5″ (D) x 3.8″ (H)

Options

Features & Benefits

  • Mactronix Top-Bottom Wafer Flat Finder “TBM” is designed for manual flat finder alignment.
  • The patterned side of the wafer never touches the carrier during rotation.
  • The machine may be configured to accommodate a large diversity of Plastic, Teflon, and metal carriers.
  • The aligned wafer flats may be manually positioned to any other orientation desired by slowly turning the roller knob.
  • Uptime will exceed 99.25%.
  • MTBF (mean time between failure): 2,500 hours
  • MTBA (mean time between assist): 1,000 hours
  • MTTR (mean time to repair): less than I hour