HZN-x25 P5 (Horizon Transfer Machine)

Specifications

  • Power:
  • 220/110VAC    50/60Hz    Single Phase
  • 3 Amp @ 110VAC
  • CDA/N2:
  • 75 to 90 psi
  • Grounding:
  • Single Point Low Impedance VAC (provided)
  • Exhaust:
  • 1.25″ Diameter port; 5 CFM max (non-process)
  • Wafer Size:
  • 3” (75 mm)  thru  8” (200 mm)
  • Weight:
  • ≈ 50 Lbs.
  • Dimensions (W x D x H):
  • 75mm thru 150mm (3″ thru 6″): 8″ x 14″ x 32″
  • 200mm (8 inch): 10″ x 14.5″ x 32.5″
  • NOTE: Optional Extended Platform will add ≈ 6″ to the overall width of the machine.

Options

  • Extended Platform
  • RS232 Communications
  • Recessed mounting
  • Vespel package for high temperature applications
  • Stainless steel covers.
  • Hot boat sensor

Features & Benefits

  • The Horizon Junior Series V will transfer a maximum of 25 wafers between two cassettes, two process boats or one process boat and one cassette.
  • As with all Mactronix wafer transfer systems, the Horizon Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
  • PLC controlled enhancing the transfer machine’s simplicity.
  • With the push of a button, the machine transfers wafers safely and automatically.
  • The Horizon Series V machines are designed to limit particle contamination by using a stepper motor w/lead screw, “clean room grade” rails and bearings and a 1.25″ non-process exhaust port.
  • The machine will not introduce more than 1.5 particles, greater than .23 micron in diameter, per wafer per transfer (machine must be exhausted to achieve this figure).
  • All aluminum parts are hard black anodized for corrosion resistance.
  • Electronic through beam sensors are used to detect wafer presence in boats and retainers thus preventing accidental double loading and scratches.
  • Lift system uses ramped speed controls for gentle pick-up and landing.
  • Pressure sensors are used both for personal safety and to prevent wafer damage by inhibiting machine operation.
  • Retainers default to closed position to prevent the dropping of wafers in the event of a power disruption or a loss of air pressure or both.
  • A “Maintenance/Cleaning Mode” is provided to facilitate preventative maintenance.
  • The Series V machines have been tested with up to 50,000 volts of electrostatic discharge without disruption to internal electronics. The Series V machines are virtually immune to RFI noise, EMF, and ESD.
  • Uptime will exceed 99.25%.
    • MTBF (mean time between failure): 2,500 hours
    • MTBA (mean time between assist): 1,000 hours
    • MTTR (mean time to repair): 1 hour
  • PLC controller is equipped with an RS422 communications port.