PCB-x00 (Pitch Changing Back-to Back)


  • Power:
  • 220/110VAC    50/60Hz    Single Phase
  • 3 Amp @ 110VAC
  • CDA/N2 :
  • 80 to 90 psi
  • Gronding
  • Single Point Low Impedance VAC (provided)
  • Exhaust:
  • 1.25″ Diameter port; 5 CFM max (non-process)
  • Wafer Size:
  • 4″ (100mm)  thru  6″ (150mm)
  • Weight:
  • ≈ 125 Lbs.
  • Dimensions (W x D x H):
  • 13″ x 21″ x 60″
  • NOTE: Optional Extended Platform will add ≈ 10″ to the overall width.


  • Extended Platform
  • RS232 communications port
  • Recessed mounting
  • Vespel package for high temperature applications
  • Stainless steel covers
  • Hot boat sensor

Features & Benefits

  • Transfers 24 to 26 wafers between one standard pitch plastic cassette and one custom process boat in a contact back-to-back configuration.
  • As with all Mactronix wafer transfer systems, the MacLite Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
  • Machine interface is a 12 key pad with a 4 line LCD Display.
  • Designed to limit particle contamination by using lead screw drive and stepper motor, “clean room grade” rails and bearings and electric boat sensors.
  • All aluminum parts are hard black anodized for corrosion resistance.
  • Electronic through beam sensors are used to detect wafer presence in boats and retainers thus preventing accidental double loading and scratches.
  • Lift system uses ramped speed controls for gentle pick-up and landing.
  • Pressure sensors are used for both personal safety and machine safety by inhibiting machine operation.
  • Machine will not drop wafers in the event of a power failure and will prompt the operator through the “Recovery Mode” after power has been restored.
  • A “Technician Mode” is provided to facilitate preventative maintenance.
  • Uptime will exceed 99.25%.
    • MTBF (mean time between failure): 100,000 wafers
    • MTBA (mean time between assist): 25,000 wafers
    • MTTR (mean time to repair): less than 1 hour