UKA-x25 A3 (Eureka Transfer Machine)

Specifications

  • CDA/N2:
  • 70 to 90 psi
  • Exhaust:
  • 1.25″ Diameter port; 5 CFM max (non-process)
  • Wafer Size:
  • 3″ (75mm)  thru  8″ (200mm)
  • Weight:
  • ≈ 35 – 50 Lbs.
  • Dimensions (W x D x H):
  • 75mm thru 150mm (3″ thru 6″): 8.2″ x 12.2″ x 26.3″
  • 200mm (8 inch): 10″ x 14.5″ x 32.5″
  • NOTE: Optional Extended Platform will add ≈ 6″ to the overall width of the machine.

Options

  • Extended Platform
  • Recessed mounting
  • Vespel package for high temperature applications
  • Stainless steel covers.
  • Hot boat sensor

Features & Benefits

  • The Eureka Junior Series III will transfer a maximum of 25 wafers between two cassettes, two process boats or one process boat and one cassette.
  • As with all Mactronix wafer transfer systems, the Eureka Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
  • With the push of a button, the machine transfers wafers safely and automatically.
  • The Eureka Series wafer transfer machines have a proven track record and are completely air operated, therefore cost effective. Its simple design eliminates extensive R&M training.
  • Flat alignment is preserved during transfer.
  • Pressure sensors are used for both personal safety and machine safety by inhibiting machine operation.
  • Retainers default to closed position to prevent dropping wafers in the event of an air pressure loss.
  • Aluminum parts are hard black anodized for corrosion resistance.
  • Wafer contact is minimized to ensure maximum cleanliness for critical diffusion processes, improving yields and productivity.
  • Uptime will exceed 99.25%.
    • MTBF (mean time between failure): 2,500 hours
    • MTBA (mean time between assist): 1,000 hours
    • MTTR (mean time to repair): 1 hour